FE5238 - High conductivity stretchable adhesive
FE5238 is a low temperature cure non conductive adhesive (NCA). FE5238 can be deposited by syringe, screen or stencil for mechanical support in component attach in rigid-flex electronics. It is designed to accompany the ACI electrically conductive adhesive (ECA) FE1101 and can be co-cured with FE1101 allowing for high throughput.
FE1101 - Low Temperature Cure Insulating Adhesive
FE1101 is one-part conductive epoxy. It cures at temperatures as low as 70 ºC making it is well suited for the substrates with low temperature requirements such as polyester and TPU. FE1101 is compatible ACI inks and encapsulants and is optimized for use in rigid-flex circuits. As a one-part system FE1101 has a pot life of over a month at 20ºC allowing for large batch long production runs to be done with no change in viscosity or throughput.
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